Live Review
Live Review
The Open Compute Tech Summit 2026 will be held on July 9 at the Beijing International Hotel. Initiated by the Open Compute Project (OCP), the world's largest open compute community, the summit has been successfully held for seven sessions. As Asia's largest open compute technology summit with the most extensive ecosystem coverage, it is committed to building a global open-source alliance and establishing an in-depth collaborative platform connecting upstream and downstream players across the global data center industrial chain.
Co-hosted by OCP and Open Compute Technology Committee (OCTC) of China Electronics Standardization Association, this summit—themed "Intelligence Without Limits: Open, Diverse, Scalable"—will bring together leading international standards organizations such as OCP, OCTC, SPEC, and the OpenFirmware, as well as industry leaders including Alibaba Cloud, ByteDance, Baidu, NVIDIA, Samsung, Flex, IEIT SYSTEMS, LuxshareTech, QING HONG ELECTRONICS, BPS, and JONHON, along with open-source community leaders and top technical experts, to jointly explore cutting-edge innovations and industrial applications in open computing, accelerate the large-scale deployment of AI across all scenarios, and uncover new growth opportunities in the computing power industry.
Chief Executive Officer, OCP Foundation
Secretary-General of OCTC, Director of the Hardware Research Laboratory at the China Electronics Standardization Institute / Research Institute
Board Member of UALink and CXL
Deputy General Manager, IEIT SYSTEMS
Chief Architect of Cloud Server Infrastructure, Senior Director of Engineering, Alibaba Cloud, Representatives of the CXL and UCIe Boards
Server Architect, ByteDance
Senior Director of NVIDIA Networking APAC
VP, Solution Development Team, Samsung Electronics
Optical Product Manager, Dongguan Luxshare Technology Co., Ltd.
Product Director, Qing Hong Electronics(Suzhou)Co.,Ltd
Director of RD & Product Management Department, Flex Electronics(Shanghai)Co.,Ltd
Senior Product Marketing Manager, High Performance Computing, BPS
Product Manager, Liquid Cooling BU. JONHON OPTRONIC TECHNOLOGY CO.,LTD
OCP China Community Lead
Chief Emerging Ecosystem Officer
NAND AE Group(Memory)Manager, Samsung Electronics
Hardware Solution Manager, High-Performance Computing, BPS
Power Products Senior Expert, Murata (China) Investment Co., Ltd.
Technical Marketing Director, Credo Technology
Photonics Chip Architect, Shanghai Beeplux Semiconductor Technology Co., Ltd.
R&D Director, LTK Electric Wire (Huizhou) Ltd.
Firmware Architect , Bytedance
Senior Director of Community
Professor, Hefei University of Technology
Marketing Director, Consumer, Computing & Communication Segment, Greater China, Infineon Technologies
Senior FAE Manager, InnovisionSemi
Senior Product Manager, Hubei JND Technology Group Co.,Ltd.
IDC Product manager, Tonhe Technologies
Deputy General Manager, Xi'an Actionpower Electric Co., Ltd.
Data Center Power R&D and Architecture Engineer, Alibaba Cloud Intelligence
AIDC Architect, Sungrow Power Supply Co., Ltd.
System Engineer, Texas Instruments
General Manager, AMI
CTO, Sitelin Hydraulic Manufacturing (Ningbo) Co., Ltd.
Thermal Engineer, TYSON COOLING
PM, Hefei Shinhoo Canned Motor Pump Co., Ltd.
Department Manager of Components Products, Solar & Commercial Products, Greater China, TÜV Rheinland Group
Thermal Solution Architect, Baidu
System Power Engineer, Bytedance
SPEC/OSG CPU Committee Chair
NAND AE Group(Memory)Manager, Samsung Electronics
Intelligent Solution Part Manager, Samsung Electronics
Product Manage, Flex Electronics(Shanghai)Co.,Ltd
Product Manager, Data & Telecom BU. JONHON OPTRONIC TECHNOLOGY CO.,LTD
Battery System Research Institute Advanced Battery System Product Center Director, EVE Energy Co., Ltd.
Senior R&D Engineer, Baidu
Senior Product Manager, IEIT SYSTEMS CO.,LTD.
Staff Firmware Architect , Baidu
Firmware Architect, Bytedance
Power Supply Solution Architect, Baidu
Firmware Architect, Bytedance
Firmware Development Engineer,STE
Chief Ultra-Link Architect, Alibaba Cloud, Representative of the UALink Board
Field Technical Director, VAST Data
FAE Manager, Qing Hong Electronics(Suzhou)Co.,Ltd
Product Manager, Luxshare-Tech
China Electronics Standardization Institute, Information Technology Research Center
AIPowerDC/21Dianyuan Director Marketing
Technical Director of Power Supply Solutions for Data Centers, Weichai Heavy Machinery Co., Ltd
Deputy General Manager, Liquid Cooling BU, Jonhon Optronic Technology Co., Ltd.
Research Scientist, MetaX
AI Architect, Infrastructure Systems Department, Baidu Smart Cloud
Cloud BMC Architect, Alibaba
Firmware Engineer, IEIT SYSTEMS
Senior Firmware Development Engineer, Phytium Technology
Head of Kunlun BMC Team, Kunlun Technology
Software Development Engineer, Lenovo
China Electronics Standardization Institute, Information Technology Research Center
Vice President of Connflix Networking Technology (Shandong) Co., Ltd.
VNET Group, Senior Director of Energy Innovation Division
Senior Technical Expert, China Mobile
Deputy General Manager, LinkedSemi Microelectronics (Hangzhou) Co.,Ltd.
Senior Technical Expert, China Mobile Research Institute
Principal Researcher, China Mobile Research Institute
Software Manager, CNIT
Agentic AI is accelerating the implementation of intelligent enterprise solutions, while platforms such as OpenClaw and Qiqianxia are driving computing infrastructure to evolve from model support toward agent collaboration. Centered on the themes of "Open, Diverse, and Scalable," this forum focuses on open systems, heterogeneous computing, AI networking, storage, high-speed interconnects, power supply, and liquid cooling to build a new foundation for open computing in the era of AI agents.
Focusing on the evolution of AI data center underlying architecture, the forum will cover power supply, high-speed interconnects, silicon photonics switching, copper cabling, and system management to drive the upgrade of open infrastructure.
